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Molded Interconnect Devices: Metallization Process

Electroless plating is the method for forming electro-mechanical traces on the laser defined structures or the double-shot molded component. The metallization sequence is electroless copper plating (100 to 600 micro inches), electroless nickel plating (50 to 100 micro inches) and optional immersion gold plating (3 to 8 micro inches).

The first step in the process is […]

March 29th, 2016|Categories: News & Events||

Laser Direct Structuring for Security Shields & Housings

SelectConnect Technologies is a U.S. based service provider of Laser Direct Structured (LDS) security shields and housings to protect sensitive electronics and information in ATM, bank, defense, aerospace, medical devices and next-generation miniaturized products.
We provide state-of-the-art Laser Direct Structuring services – to produce tamper resistant three dimensional security shields on injection molded components. The housings […]

March 29th, 2016|Categories: News & Events||

3D MID Applications

3D MID applications are the focus of the automotive and medical device industry. In a 3D-MID, surface mount device components are normally on multiple levels.

Applications for 3D-MIDs are increasing due to the need to miniaturize, reduce costs and the wider availability of 3D-MID manufacturing service providers.

Common 3D MID Applications:

IV Regulators (medical)
Barometric pressure sensors (industrial)
Laptop antennas […]

March 29th, 2016|Categories: News & Events||

3D MID Technology and its Unique Benefits

When you selectively metallize circuitry on plastic, you create what is called a 3 Dimensional Molded Interconnect Device or 3D MID. 3D Molded Interconnect Devices consist of circuit traces embedded onto molded thermoplastics to form electrical pathways and landings for surface mount components.

3D MIDs combine electrical and mechanical functionality. Electronic circuit traces are formed on […]

March 29th, 2016|Categories: News & Events||

Laser Direct Structuring for Cell Phone Antennas

Not long ago someone thought of combining circuits and plastic components. The result, 3 dimensional molded interconnects (3D MID), changed the way cell phone antennas are made today.

Today, cell phone antennas are no longer planer; reception isn’t dependent on your orientation to the tower.

You can get multiple antenna into smaller spaces because you have integrated […]

March 29th, 2016|Categories: News & Events||

Laser Direct Structuring for Sensor Packaging

Is Laser Direct Structuring ideally suited for Senor Packaging?

Yes!

Imagine where sensors go. They are not in the most conspicuous places. They are in hard to reach areas.

We have sensors in brake systems, optical systems, electrical and vision system. We have sensors in some really funny places. These are usually places where we don’t have a […]

March 29th, 2016|Categories: News & Events||

Laser Direct Structuring for Data Security Devices

Data security is a growing industry. Intrusions are being made into data devices by putting sensors into them and getting sensitive data out.

Devices like:

Computers
ATMs
Point of Sale devices

It’s all about detecting intrusion and the best way to do this is to have some sort of trip wire going throughout your device.

You want to do this with […]

March 29th, 2016|Categories: News & Events||

Laser Direct Structuring: The Perfect Compliment to Printed Circuit Boards

How would a part with laser direct structuring (LDS) work in conjunction with a Printed Circuit Boards (PCB)?
A very common misconception when looking at Laser Direct Structuring is that one can replace a Printed Circuit Board.
Laser Direct Structuring is not designed to replace a Printed Circuit Board, in fact it is more to compliment a […]

March 29th, 2016|Categories: News & Events||

3D MID Technology Explained

Below, Mike Stertz with SelectConnect Technologies explains 3D MID technology with specific detail.

While 3D MID technology is incredibly advanced and innovative, particularly in the U.S., the actual 3D MID process is not overly difficult to comprehend. Mike Stertz of SelectConnect Technologies does a great job of explaining this process and technology with easy to understand […]

March 21st, 2016|Categories: News & Events||

Laser Direct Structuring Benefits

Our interview with President of LPKF, Stephan Schmidt is summarized below.

President of LPKF, Stephan Schmidt states one of the biggest benefits of Laser Direct Structuring is its ability to go around curves, in small places and anywhere you’re constrained by the X, Y and Z axes.

What makes Laser Direct Structuring technology so attractive is SelectConnect’s […]

January 12th, 2016|Categories: News & Events||