White Papers
SelectConnect Technologies is dedicated to the advancement of 3D MID technology.
Our research into the metallization of circuitry on plastics has been published in several leading industry publications.
The links below direct you to the FREE information guides we have developed to get you started designing your 3D MID. Need help, feel free to contact us.
SelectConnect Process for Metallizing Circuits on Molded Components
Learn how to create a 3-Dimensional Molded Interconnect Device through the selective metallization of circuitry on molded components in this informative paper.
How To Compensate For Plating Growth Of LDS Lines and Spaces
It’s really quite easy to design 3-D MID’s via Laser Direct Structuring. But first you need to know the real parameters to be considered before you determine the resolution (size) of the lines and spaces in your circuitry. Find out what they are in this ground breaking white paper.
Beginner’s Guide to Laser Direct Structuring
Learn everything you need to get started designing for Laser Direct Structured 3D MID’s.
Security Shield eBrief
Keeping sensitive data (IP) secure from intrusion is the top priority for Corporations. Find out more in this report.
How to Create a 3d MID Using the 2-Shot Process
Perfect if you need high volume/low cost production of a 3D MID.