Abstract
Trace Width and Space Limitations
for Laser Direct Structuring
By Dave Klitzke and Richard Macary
ABSTRACT
Laser direct structuring (LDS) is the first step of a manufacturing process that creates circuit traces on molded thermoplastic components.
LDS is currently the leading technology used to produce cell-phone antennas and has been more widely used to produce a range of components for use in medical devices, security shields, automotive sensors and GPS antennas – anywhere product miniaturization is a driving force.
The LDS process utilizes a laser beam to scribe a pattern onto a 2 or 3-dimensional injection molded carrier or enclosure that will be the foundation for subsequent metallization.
Circuit or antenna artwork from a CAD file is translated into laser plotting software. Structuring occurs when the laser tool activates metal organic additives in the (LDS grade) plastic part. This allows the electroless plating to attach to only to the structured area.
At SelectConnect Technologies, we conducted experiments to determine how close LDS traces can be structured and metalized without inducing over plating or bridging on three common materials including LCP, PET/PBT, and PC/ABS. Trace widths of 0.010 in (0.254 mm) with a spacing of 0.010 in (0.254 mm) have been achieved. This report will determine the feasibility of achieving trace widths and spacing below these parameters.
To determine this, we produced geometric patterns with varying trace widths and spacing distances and structured it onto plaques made from the three different materials using an LPKF Microline 160 laser system.
Following this, the plaques were plated with copper, nickel, and immersion gold. The parts were examined for signs of over plating and trace widths and spacing were measured using video microscopy equipment.
The data and results of the experiments are reviewed and discussed.
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