SelectConnect LDS

3D-MIDs are created either by laser direct structuring (LDS) or double-shot molding processes

LDS 3D-MID’s are created by first molding a component from thermoplastic resin doped with an organometallic material.  Circuit layouts are patterned on the molded component with a process called Laser Direct Structuring or LDS, using a laser beam from the LPKF Microline 3D laser system to create the desired circuit paths.  The laser defined pattern is then plated with electroless copper, electroless nickel, and immersion gold to enhance the electrical and assembly characteristics of the 3D-MID.