SelectConnect DS

3D-MID’s can also be formed with a double-shot molding process where the first shot is a non-plateable material (such as polycarbonate) and the second shot is a plateable grade (such as PC/ABS doped with palladium) that forms the base for the circuit path.  A chromic acid etching process activates the surface of the second shot material, which is then metalized with electroless copper, electroless nickel and an optional immersion gold layer.