News & Events

SelectConnect Technologies Publishes White Paper on Sensor Manufacturing

 

PALATINE, Illinois, USA, June 19, 2017 –SelectConnect Technologies has published the white paper, “Laser Direct Structuring for Sensor Manufacturing.” The white paper details how sensor technology employing laser direct structuring (LDS) results in reduced manufacturing costs, while increasing the physical strength and durability of a position sensor.

Millions of electronic components with complex geometries are manufactured […]

June 18th, 2017|Categories: News & Events||

SelectConnect Technologies Publishes White Paper on Laser Direct Structuring

PALATINE, Illinois, USA, April 5, 2017 –SelectConnect Technologies has published the white paper, “Trace Width and Space Limitations for Laser Direct Structuring.” The white paper details a study that was conducted to determine how close laser direct structuring (LDS) traces can be created and metallized without inducing over plating or bridging on PET/PBT material.

A geometric […]

April 4th, 2017|Categories: News & Events||

SelectConnect Technologies Launches 3Discussions™ Blog

PALATINE, Illinois, USA, March 23, 2017 –SelectConnect Technologies officially launched the blog, “3Discussions™” this week. With the objective of fostering discussions and collaboration throughout the supply chain, 3Discussions is dedicated to the advancement, applications and benefits of three-dimensional molded interconnect devices (3D-MID).

3Discussions was created in response to high industry demand for production-proven information on producing […]

March 22nd, 2017|Categories: News & Events||

Major Corporate Expansion Completed

PALATINE, Illinois, USA, March 6, 2017 – Arlington Plating Company, the parent company of SelectConnect Technologies, is pleased to announce a major expansion at its Palatine, Illinois headquarters that has resulted in enhanced operations and production capabilities for both companies.

Specifically, the recent addition of a 35,000 square foot facility substantially grows the company’s campus to […]

March 8th, 2017|Categories: News & Events||

Molded Interconnect Devices: Metallization Process

Electroless plating is the method for forming electro-mechanical traces on the laser defined structures or the double-shot molded component. The metallization sequence is electroless copper plating (100 to 600 micro inches), electroless nickel plating (50 to 100 micro inches) and optional immersion gold plating (3 to 8 micro inches).

The first step in the process is […]

March 29th, 2016|Categories: News & Events||

Laser Direct Structuring for Security Shields & Housings

SelectConnect Technologies is a U.S. based service provider of Laser Direct Structured (LDS) security shields and housings to protect sensitive electronics and information in ATM, bank, defense, aerospace, medical devices and next-generation miniaturized products.
We provide state-of-the-art Laser Direct Structuring services – to produce tamper resistant three dimensional security shields on injection molded components. The housings […]

March 29th, 2016|Categories: News & Events||

3D MID Applications

3D MID applications are the focus of the automotive and medical device industry. In a 3D-MID, surface mount device components are normally on multiple levels.

Applications for 3D-MIDs are increasing due to the need to miniaturize, reduce costs and the wider availability of 3D-MID manufacturing service providers.

Common 3D MID Applications:

IV Regulators (medical)
Barometric pressure sensors (industrial)
Laptop antennas […]

March 29th, 2016|Categories: News & Events||

3D MID Technology and its Unique Benefits

When you selectively metallize circuitry on plastic, you create what is called a 3 Dimensional Molded Interconnect Device or 3D MID. 3D Molded Interconnect Devices consist of circuit traces embedded onto molded thermoplastics to form electrical pathways and landings for surface mount components.

3D MIDs combine electrical and mechanical functionality. Electronic circuit traces are formed on […]

March 29th, 2016|Categories: News & Events||

New Surface Activation Technology

New surface activation technology allows you to plate previously impossible to plate plastics like PEEK, Ultem, Nylon and Acetal without the use of chemical or mechanical etching. This process is perfect for connectors and replaces cadmium for military specification MTL-DTL-38999.

Benefits of Plating on PEEK, Ultem, Nylon and Acetal Over Traditional Plastics:

More strength (glass/carbon reinforced)
High temperature […]

March 29th, 2016|Categories: News & Events||

Laser Direct Structuring for Cell Phone Antennas

Not long ago someone thought of combining circuits and plastic components. The result, 3 dimensional molded interconnects (3D MID), changed the way cell phone antennas are made today.

Today, cell phone antennas are no longer planer; reception isn’t dependent on your orientation to the tower.

You can get multiple antenna into smaller spaces because you have integrated […]

March 29th, 2016|Categories: News & Events||