Laser Direct Structured 3-Dimensional Molded Interconnects (LDS 3D-MID) are now appearing in key automotive applications to reduce costs and improve reliability.

Today's automobiles have hundreds of sensors and electronic aides that improve the comfort and safety of passengers.  

 As on-board systems increase, engineers are focusing on ways to rein in costs.  Molded Interconnect Devices (MIDs) that combine circuitry with components to eliminate wires, flex circuits, interconnects and printed circuit boards are being employed to deliver enhanced functionality at reduced cost.

 Electro-mechanical functions such as buttons, switches and indicators are being integrated with functional component acting as the circuit carrier, delivering high reliability, cost effective assemblies.  The LPKF-LDS process used at SelectConnect Technologies is used to produce cost effective, integrated components.