Automotive
Key automotive applications are now utilizing Laser Direct Structuring of 3-D Molded Interconnect Devices (LDS 3-D MID) to reduce weight and increase reliability.
LDS creates 3-D circuit boards on plastic. Because circuits run along the contours of molded components you have twice the surface area to work with compared to a traditional pcb.
Weight reductions come from:
- The elimination of multi-layer circuit boards
- The replacement of an aluminum chassis with a thermoplastic component.
- The elimination of wires through the integration of the circuitry.
Fewer wires lead to a more reliable component due to fewer connection points that are prone to shake loose.
Other Advantages
- Circuits can be run through holes and up walls allowing for true 3-D design.
- Proper material selection allows for reflow soldering of surface mount components.
- Circuits can also be connected utilizing pads, pins, wire bonding and other connection types.
- LDS utilizes electro-less plating to metalize the circuitry and is RoHS compliant.
You can find out more from the SelectConnect 3-D MID webcast. Be sure to watch until the end. Several Automotive related examples are highlighted.
SelectConnect Technologies is the only US based contract supplier of LDS Technology. We can help you from prototype through high volume production of your component/device. Contact Us today for a complimentary technology review at (847) 359-1490.
Source: I&T 3D-Produktionsgesellschaft GmbH
