SelectConnect Technologies manufactures 3-dimensional molded interconnects using the LPKF-LDS process to laser scribe circuitry on injection molded components and selectively plates circuits integrated into components produced by the Double-Shot molding process.

As the only contract provider of LDS 3D-MID services in North America, we work on projects from early phase prototypes scale up to high-volume production.    Contact us to learn more about our processes and technologies.  We are happy to help.