About Us
SelectConnect Technologies, a Division of Arlington Plating Company, manufactures three-dimensional molded interconnect devices (3D-MID) utilizing Laser Direct Structuring and Double-Shot methods. SelectConnect Technologies also provides Plating on Plastic (PoP) utilizing Surface Activation and Ionic Palladium. Applications exist for the military, aerospace, medical device, RF antenna, RFID, sensor, security housing and connnector markets.
A 3D-MID consists of circuit traces (3D Circuits on Plastic) embedded onto molded thermoplastics to form electrical pathways and landings for surface mount components.
Designing systems with LDS 3D-MID components allow designers to reduce the bill of material (BOM), the complexity of components, size, weight and assembly times by having fewer components, wires and interconnects.
Laser Direct Structuring is a process in which a CAD file is fed into a specialty laser system which then structures the circuit pattern onto the part surface creating a 3D MID. The 3D MID is then electroless plated for conductivity.
The Double-Shot process consists of an injection molded part over-layed with a 2nd injection (double-shot) of plateable material which forms the circuit directly into the chassis. The part is then electroless plated for conductivity.
Plating on Plastic (PoP) using the Surface Activation Process allows plating hard to plate material such as PEEK, Ultem, Nylon and Acetal without the use of Chromic Acid or Mechanical Etching. The result is a uniform, smooth finish with better adhesion.
Contact us for a complimentary technology review by Signing Up at the top or bottom of this page or call (847) 359-1490.
Specialties
3D MID
3D Circuits on Plastic
Laser Direct Structuring
Double Shot Method
Surface Activation
Plating on Plastic (PoP)
Ionic Palladium
Electroless Plating
SelectConnect Technologies is ISO 9001 and ITAR Certified.
