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SelectConnect Technologies - Home

LDS_ProcessSelectConnect Technologies, a Division of Arlington Plating Company, manufactures three-dimensional molded interconnect devices (3D-MID) for the medical device, automotive, aerospace, military, RF antenna, RFID, sensor, security and connector markets.

A 3D-MID consists of circuit traces embedded onto molded thermoplastics to form electrical pathways and landings for surface mount components.

Compared to 2-dimensional printed circuit boards or a flexible circuit wrap, a 3D-MID can take the shape of a molded component allowing circuit paths to be created on non-conductors, typically used for the enclosure, chassis, and device structure. The electrical path is patterned in true 3D with x, y and z-patterns following the contour of the molded component.

Designing systems with LDS 3D-MID components allow designers to reduce the bill of material (BOM), the complexity of components, size, weight and assembly times by having fewer components, wires and interconnects.

mid before and after 2 modified

LDS produced 3D-Molded Interconnect Devices (3D-MID) reduce the bill of materials, eliminate wires and interconnects and reduce assembly time delivering improved reliability.

Join our LinkedIn Group to connect with others using and learning about LDS 3D-MID. 

 

See us at these up and coming trade shows and exhibitions


Learn about our LDS and DS 3D-MID techonolgy at our July 27th. Webcast.

Sign Up Now -> LDS 3D-MID Webcast Sign Up

The following paper was presented at the June 9 -10  IMAPS Workshop.

Laser Direct Structuring Method of Integrating Circuitry with Three-Dimensional Components

Laser Direct Structuring (LDS) is a process to produce circuit layouts on complex three-dimensional carrier structures to effectively reduce weight and fitting-space. Designers enjoy complete 3-D capability on free-form surfaces, greater freedom for redesigns, the possibility of using surface mount technology and significant cost reductions through elimination of the number of components, reduction of wires and interconnects and the resultant decrease in assembly times. This talk describes the LDS technology, materials, design considerations, the metallization process and numerous examples of applications currently in production or development.

MDM Minneapolis

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October 13 - 14, 2010
Minneapolis Convention Center Minneapolis, MN

Antenna Systems

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October 19 - 20, 2010
Gaylord Texan Resort & Convention Center

 

 

 

 

 

 

 

 

 

 

 

 

 

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